Speaker
Description
ALICE 3 is the next-generation heavy-ion experiment proposed for the LHC Run 5 and 6. Its tracking system will be based on a vertex detector, integrated into a retractable structure inside the beam pipe to achieve the best possible pointing resolution, and a large outer tracker, surrounding the vertex detector and covering about eight units of pseudorapidity ($|\eta|<4$). The tracking system will be based on Monolithic Active Pixel Sensor (MAPS) technology. It will leverage the sensor developments carried out for the recently upgraded ALICE Inner Tracking System and the future ALICE ITS3. The total area of the ALICE 3 silicon tracker is about 60 m$^{2}$, a factor of five larger than the ALICE ITS2, so one of the challenges is a mass chip test and module assembly. The Korea ALICE group has started R\&D to utilize an automatic die-attach machine, which is generally used for semiconductor packaging in the industry. This talk will discuss R\&D activities from the Korea ALICE group on the industrialization of module assembly for the ALICE 3 Outer Tracker.
